Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interpolated cylinder

ABSTRACT

A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

CLAIM OF PRIORITY

This application is a divisional of application Ser. No. 12/762,510,filed on Apr. 19, 2010, now allowed, which claims priority from JapaneseApplication No. P2009-103139, filed Apr. 21, 2009, in the JapanesePatent Office. The contents of U.S. Ser. No. 12/762,510 are incorporatedherein by reference in their entirety.

TECHNICAL FIELD

The present invention relates to a concave connector substrate intowhich a substrate, a card, or a chip electrically connected to a systemis inserted in a card edge type, a method of manufacturing the same, ameasuring kit, a sensor substrate, and a sensor substrate interpolatedcylinder.

BACKGROUND ART

With an increase in the degree of integration or the processing speed ofsemiconductor devices and a reduction in power consumption, thedevelopment of small and high-performance information communicationapparatuses, such as mobile phone, electronic dictionaries, and digitalvideo cameras has been accelerated. Various kinds of memory cardsincluding memory devices for storing information can be inserted into orremoved from the mobile apparatuses in a card edge type (for example,see Patent Document 1). USB-type (Universal Serial Bus) concaveconnectors that are mainly used in personal computers as well ascard-insertion-type concave connectors have been utilized in order tocontrol peripheral devices each other, such as a printer, a mouse, and ameasuring device. In recent years, internationally standardized concaveconnectors for connection to parts mounting LEDs that have beendeveloped have drawn attention. In a flexible rigid plate in which aflexible rigid substrate is used in a common inner layer in order toconnect multi-layered printed circuit boards each other, a structure hasbeen proposed in which a concave connection portion is provided in themulti-layered substrate, not the common inner layer (for example, seePatent Document 2).

PRIOR TECHNICAL DOCUMENT Patent Document

-   Patent Document 1: Japanese Patent Application Laid-Open (JP-A) No.    2005-32446-   Patent Document 2: JP-A No. 2004-335547

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

In the system in which a connector unit (convex type), such as anelectrochemical measurement substrate, a memory card, or a sensor chip,is inserted into a connector (concave) that is concave and convex withrespect to the connector unit so as to be electrically connectedthereto, a concave connector formed by the manufacture of a case using aprecision mold, the mechanical processing of terminal leads, and apackaging process for them is needed in order to accurately fit theconnectors. However, it is difficult to reduce the manufacturing costsof the concave connector when responding to small quantity batchproduction. In the design of the thickness of a substrate, a card, or achip to be inserted or connection terminals, the flexibility of thedesign is restricted by the specifications of the concave connector.

The invention has been made in order to solve the above-mentionedproblems and an object of the invention is to provide a method ofmanufacturing a concave connector substrate in which connector terminalsand cables are integrated with each other and which can ensure theflexibility of the design of a convex connector to be inserted andachieve high strength, high-accuracy connection, and low manufacturingcosts.

Another object of the invention is to provide a method of manufacturinga concave connector substrate in which connector terminals, cables, andthrough hole connection portions are integrated with each other andwhich can ensure the flexibility of the design of a convex connector tobe inserted and achieve high strength, high-accuracy connection, and lowmanufacturing costs.

Still another object of the invention is to provide a concave connectorsubstrate that can be easily bent or a concave connector substrate thatcan be easily bent and hold the bent position, and a measuring kit, asensor substrate, and a sensor substrate interpolated cylinder that aresuitable for the use of the concave connector substrate.

Means for Solving the Problems

In order to solve the above-mentioned problems, the inventors have founda structure in which connector terminals and cables are integrated witheach other and which has the flexibility of the design of a convexconnector to be inserted and has high connection accuracy and lowmanufacturing costs and a method of manufacturing the same.

The invention is as follows.

(1) A method of manufacturing a concave connector substrate comprising:

preparing a guide substrate having a guide/holding region that guides aplate-shaped connector provided with an electronic device to beconnected to a connection position and holds the plate-shaped connectorat the connection position and a cut portion for removing a sectionhaving a shape corresponding to the guide/holding region on at least oneside;

arranging and aligning two wiring substrates, each having wiring linesobtained by integrating connector terminals with cables and through holeconnection portions that are electrically connected to the wiring lines,with both surfaces of the guide substrate such that one surface havingthe wiring lines and the through hole connection portions formed thereonfaces the guide substrate and one side of the guide substrate having thecut portion formed therein faces the connector terminals, and applyingan adhesive to a region of the guide substrate other than the inside ofthe cut portion to bond the wiring substrates to the guide substrate;

bending a portion of the wiring substrate toward the inside of the cutportion of the guide substrate and bringing the wiring lines disposed inthe bent portion into pressure contact with the inside of the cutportion; and

removing a section inside the cut portion to form the guide/holdingregion.

(2) The method of manufacturing a concave connector substrate accordingto above-mentioned (1),

wherein pins are uprightly provided in the through hole connectionportions.

(3) A method of manufacturing a concave connector substrate comprising:

preparing a guide substrate having a guide/holding region that guides aplate-shaped connector provided with an electronic device to beconnected to a connection position and holds the plate-shaped connectorat the connection position and a cut portion for removing a sectionhaving a shape corresponding to the guide/holding region;

arranging and aligning two wiring substrates, each having wiring linesobtained by integrating connector terminals with cables, a metal layerthat is provided on one surface opposite to the surface having thewiring lines formed thereon, and a window that is provided in a regionof the metal layer facing the connector terminals, with both surfaces ofthe guide substrate such that the surface having the wiring lines formedthereon faces the guide substrate, and applying an adhesive to a regionof the guide substrate other than the inside of the cut portion to bondthe wiring substrates to the guide substrate;

pressing a base surface of the wiring substrate exposed from the windowto bend the wiring substrate and bringing the wiring lines disposed inthe bent portion into pressure contact with the inside of the cutportion; and

removing a section inside the cut portion to form the guide/holdingregion,

wherein the thickness of the section of the guide substrate is set to beless than the maximum thickness of the plate-shaped connector.

(4) The method of manufacturing a concave connector substrate accordingto above-mentioned (3),

wherein a dummy conductor pattern corresponding to a conductor patternof the plate-shaped connector is formed in the section of the guidesubstrate, and

a portion of or the entire dummy conductor pattern in the section of theguide substrate is removed.

(5) The method of manufacturing a concave connector substrate accordingto above-mentioned (3),

wherein a dummy conductor pattern corresponding to a conductor patternof the plate-shaped connector is formed in the section of the guidesubstrate, and

the thickness of the dummy conductor pattern in the section of the guidesubstrate is less than that of the conductor pattern of the plate-shapedconnector.

(6) The method of manufacturing a concave connector substrate accordingto any one of above-mentioned (3) to (5),

wherein a plate-shaped low-elasticity base is provided outside thewiring substrate in a laminated direction, and

the base surface of the wiring substrate exposed from the window ispressed through the plate-shaped low-elasticity base to bend the wiringsubstrate.

(7) The method of manufacturing a concave connector substrate accordingto any one of above-mentioned (1) to (5),

wherein the wiring substrate is obtained by forming wiring lines on abase made of a thermosetting resin, a light-curable resin, or athermoplastic resin.

(8) A concave connector substrate that is manufactured by the method ofmanufacturing a concave connector substrate according to any one ofabove-mentioned (1) to (5) and has flexibility, comprising:

cut portions that are provided on both sides of the concave connectorsubstrate in a width direction orthogonal to a direction in which wiringlines extend and form non-compliant regions which do not follow bendingwhen the concave connector substrate is bent at the center in thedirection in which the wiring lines extend,

wherein the cut portions are set to a size that allows one end of theconcave connector substrate to be engaged with the non-compliant regionswhen the concave connector substrate is bent in a substantially U shape,and

the concave connector substrate includes a locking means that engagesthe non-compliant regions with the one end of the concave connectorsubstrate and locks the non-compliant regions at the engagementposition.

(9) The concave connector substrate according to above-mentioned (8),

wherein the locking means includes cutouts that are formed in theconcave connector substrate and the non-compliant regions and areengaged with each other.

(10) The concave connector substrate according to above-mentioned (8),

wherein the locking means includes protruding portions that are formedin the non-compliant regions and engaging holes that are formed in theconcave connector substrate and are engaged with the protrudingportions.

(11) A measuring kit that is used to measure a sample using a sensorwith a connector which is obtained by inserting a sensor substrate intothe guide/holding region of the concave connector substrate according toabove-mentioned (8), comprising:

a cylinder into which the sensor substrate and a sample to be measuredare introduced; and

a barrel-shaped case body in which the cylinder is provided,

wherein a groove with the bottom to which the bottom of the cylinder isfitted is formed in an inner bottom of the case body, and

cutouts that hold the sensor substrate and extend from an openingportion to the bottom of the cylinder are formed in an inner wall of thecylinder.

(12) The measuring kit according to above-mentioned (11),

wherein an O-ring to which the cylinder is fitted is provided in thegroove with the bottom.

(13) The measuring kit according to above-mentioned (12), furthercomprising:

a plate-shaped member that covers the inner bottom of the case body,

wherein the plate-shaped member has an opening portion through which thecylinder passes to lock the O-ring.

(14) The measuring kit according to above-mentioned (13),

wherein the plate-shaped member is made of a metal material and has aheat dissipation property.

(15) A sensor substrate that is inserted into the guide/holding regionof the concave connector substrate according to above-mentioned (8),comprising:

a concave portion that is provided in a surface; and

three electrodes corresponding to a working electrode, a counterelectrode, and a reference electrode that are formed in the concaveportion.

(16) The sensor substrate according to above-mentioned (15),

wherein wiring lines connected to the three electrodes are buried in thesensor substrate without being exposed from the surface.

(17) A sensor substrate interpolated cylinder comprising:

a sensor substrate that is inserted into the guide/holding region of theconcave connector substrate according to above-mentioned (8); and

a cylinder into which the sensor substrate is inserted,

wherein the cylinder includes a sample feed port through which a sampleis introduced into the cylinder and a sealing means that seals anopening portion of the cylinder and the sensor substrate.

Effect of the Invention

According to the invention, it is possible to provide a method ofmanufacturing a concave connector substrate in which connector terminalsand cables are integrated with each other and which can ensure theflexibility of the design of a convex connector and achieve highstrength, high-accuracy connection, and low manufacturing costs.

According to the invention, it is possible to provide a method ofmanufacturing a concave connector substrate in which connectorterminals, cables, and through hole connection portions are integratedwith each other and which can ensure the flexibility of the design of aconvex connector to be inserted and achieve high strength, high-accuracyconnection, and low manufacturing costs.

According to the invention, it is possible to provide a concaveconnector substrate that can be easily bent or a concave connectorsubstrate that can be easily bent and hold the bent position, and ameasuring kit, a sensor substrate, and a sensor substrate interpolatedcylinder that are suitable for the use of the concave connectorsubstrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view illustrating the structure of a guide substrateaccording to the invention.

FIG. 2 is a top view illustrating the structure of a concave connectorsubstrate according to the invention.

FIG. 3 is a top view illustrating the structure of the concave connectorsubstrate according to the invention.

FIG. 4A is a top view illustrating a method of manufacturing the concaveconnector substrate according to the invention.

FIG. 4B is a cross-sectional view of a press structure illustrating themethod of manufacturing the concave connector substrate according to theinvention.

FIG. 5 is a cross-sectional view illustrating a state after apredetermined region of a wiring substrate is pressed.

FIG. 6A is a diagram illustrating the method of manufacturing theconcave connector substrate according to the invention and is a top viewillustrating a state before cut portions are removed.

FIG. 6B is a diagram illustrating the method of manufacturing theconcave connector substrate according to the invention and is a top viewillustrating a state after the cut portions are removed.

FIG. 7A is a diagram illustrating the method of manufacturing theconcave connector substrate according to the invention and is a top viewillustrating a state before the cut portions are removed.

FIG. 7B is a diagram illustrating the method of manufacturing theconcave connector substrate according to the invention and is a top viewillustrating a state after the cut portions are removed.

FIG. 8 is a diagram illustrating the pattern of a sensor substrate thatcan be used in the concave connector substrate according to theinvention.

FIG. 9 is a top view illustrating the concave connector substrate thatis manufactured by a first aspect of a manufacturing method according tothe invention.

FIG. 10 is a diagram illustrating the rear surface of a wiring substratein the concave connector substrate shown in FIG. 9.

FIG. 11 is a perspective view illustrating the arrangement of pins thatare uprightly provided in through hole connection portions of theconcave connector substrate shown in FIG. 9.

FIG. 12 is a perspective view illustrating the bent state of the concaveconnector substrate shown in FIG. 9.

FIG. 13 is a perspective view illustrating sensor substratesaccommodated in a case.

FIG. 14 is a graph illustrating the insertion or removal force of aconcave connector unit of the concave connector substrate that ismanufactured by a second aspect of the manufacturing method according tothe invention.

FIG. 15A is a top view illustrating another aspect of the concaveconnector substrate according to the invention.

FIG. 15B is a side view illustrating the bent state of the concaveconnector substrate shown in FIG. 15A.

FIG. 16A is a top view illustrating still another aspect of the concaveconnector substrate according to the invention.

FIG. 16B is a side view illustrating the bent and locked state of theconcave connector substrate shown in FIG. 16A.

FIG. 16C is a top view illustrating the state shown in FIG. 16B asviewed from the direction of an arrow X.

FIG. 17A is a top view illustrating a modification of the concaveconnector substrate shown in FIG. 16.

FIG. 17B is a side view illustrating the bent and locked state of theconcave connector substrate shown in FIG. 17A.

FIG. 18A is a schematic diagram illustrating a state in which theconcave connector substrate shown in FIG. 16 is bent and locked and isconnected to the sensor substrate in the bent and locked state tomeasure a sample in a cylinder.

FIG. 18B is a diagram illustrating the concave connector substrate FIG.18A with one end coming into contact with a mounting surface.

FIG. 19 is a top view illustrating another aspect of the concaveconnector substrate according to the invention.

FIG. 20 is a perspective view illustrating only a through holeconnection region of the concave connector substrate shown in FIG. 19.

FIG. 21 is a perspective view illustrating the concave connectorsubstrate shown in FIG. 19 that is bent and locked at an obtuse angle.

FIG. 22 is a perspective view illustrating the concave connectorsubstrate shown in FIG. 19 that is bent and locked at an acute angle.

FIG. 23 is a perspective view illustrating a measuring kit according tothe invention.

FIG. 24 is a cross-sectional view illustrating the measuring kit shownin FIG. 23 taken along a pair of cylinders.

FIG. 25A is a perspective view illustrating the cylinder used in themeasuring kit according to the invention.

FIG. 25B is a top view illustrating the cylinder shown in FIG. 25A.

FIG. 26A is a perspective view illustrating a cylinder used in themeasuring kit according to the invention which is different from thatshown in FIG. 25.

FIG. 26B is a top view illustrating the cylinder shown in FIG. 26A.

FIG. 27A is a plan view illustrating a sensor substrate that can be usedin the concave connector substrate according to the invention.

FIG. 27B is a rear view illustrating the concave connector substrateshown in FIG. 27A.

FIG. 28 is a top view illustrating the insertion of the sensor substrateinto a concave connector of the concave connector substrate according tothe invention.

FIG. 29 is a schematic diagram illustrating a state in which the sensorsubstrate inserted into the concave connector substrate that is bent asshown in FIG. 21 is inserted into the cylinder of the measuring kit tomeasure a sample.

FIG. 30 is a schematic diagram illustrating a state in which the sensorsubstrate inserted into the concave connector substrate that is bent asshown in FIG. 22 is inserted into the cylinder of the measuring kit tomeasure a sample.

FIG. 31 is a perspective view illustrating a sensor substrateinterpolated cylinder according to the invention.

FIG. 32 is a diagram schematically illustrating measurement using a flowcell.

FIG. 33A is a top view illustrating the sensor substrate.

FIG. 33B is a cross-sectional view illustrating the sensor substrateshown in FIG. 33A.

FIG. 34 is a schematic diagram illustrating an example of a structure inwhich the sensor substrate according to the invention is used as atemperature sensor.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, exemplary embodiments of the invention will be describedwith reference to the accompanying drawings. First, a guide substrateaccording to the invention will be described.

<Guide Substrate>

The guide substrate according to the invention has a guide/holdingregion that guides a plate-shaped connector of an electronic device tobe connected to a connection position and holds the plate-shapedconnector at the connection position and is used to manufacture aconcave connector. The guide substrate includes a cut portion forremoving a section having a shape corresponding to the guide/holdingregion. The guide substrate is used to manufacture a concave connectorsubstrate according to the invention, which will be described below.

The concept of the ‘electronic device’ includes, for example, asubstrate, a card, and a sensor chip that are inserted into or removedfrom the corresponding concave connectors. The ‘plate-shaped connector’is a portion of the electronic device and includes a plate-shapedconnection portion that is inserted into an insertion portion of theconcave connector when it is connected to the concave connector.

FIG. 1 is a diagram illustrating the structure of a base 1 formanufacturing the guide substrate.

In FIG. 1, reference numeral 5 in the base 1 indicates an outline alongwhich the base 1 is cut into the guide substrate after a laminatingprocess is completed. Reference numeral 6 indicates a region in whichdata for arranging a plurality of individual products on a predeterminedsubstrate is designed. In the region represented by the referencenumeral 6, two cut portions for removing sections having a shapecorresponding to the guide/holding regions that guide a plate-shapedconnector of an electronic device to be connected to a connectionposition and hold the plate-shaped connector at the connection positionare provided on the left and right sides (2A and 2B). At the connectionposition of the electronic device, connector terminals of the concaveconnector substrate contact connection terminals of the insertedplate-shaped connector and are electrically connected and fixed thereto.

It is preferable to set the thickness of the guide substrate inconsideration of the thickness of the plate-shaped connector that isused. As described above, the guide substrate is used to form theguide/holding region. Therefore, it is preferable that the thickness ofthe guide substrate correspond to the thickness of the plate-shapedconnector inserted into the guide/holding region. When the thickness ofthe guide substrate is selected in consideration of the thickness of theplate-shaped connector that is used, it is possible to form aguide/holding region with a desired spatial shape.

Specifically, it is preferable that the thickness of the guide substratebe set to be equal to the maximum thickness of the plate-shapedconnector. For example, when only the connection terminal portion of theplate-shaped connector that is used is inserted into the guide/holdingregion, it is preferable that the thickness of the guide substrate beequal to that of the connection terminal portion. When a portion that isthicker than the connection terminal portion exists in the plate-shapedconnector and the portion is also inserted into the guide/holdingregion, for example, when a protective film (coverlay) is formed inaddition to the connection terminal portion or when a semiconductor chipor a resistive element is mounted, it is preferable that the thicknessof the guide substrate be equal to that of a portion in which theprotective film is provided.

That the thickness of the guide substrate is “equal to” that of theplate-shaped connector does not means that the thickness of the guidesubstrate is completely equal to that of the plate-shaped connector, butmeans that the thickness of the guide substrate is substantially equalto that of the plate-shaped connector.

The above-mentioned thickness relationship is not established when theconnection strength between the concave connector of the concaveconnector substrate and the plate-shaped connector is increased.

The guide/holding region is for removing the regions (sections) that arerepresented by reference numerals 1A and 1B and are disposed inside thecut portions 2A and 2B of the base 1 in a laminating process formanufacturing the concave connector and may be include the cut portionsrepresented by the reference numerals 2A and 2B in FIG. 1. The cutportions 2A and 2B can be formed by a cutting operation of a router.According to this method, it is possible to process two or moresubstrates at the same time and thus improve productivity. In this case,the guide/holding region for aligning and inserting the outline ofplate-shaped connector of the electronic device which is inserted orremoved while guiding the plate-shaped connector to the connectionposition is formed inside the cut line 5.

The width of the cut portion is appropriately set according tocircumstances in order to prevent the portions of the guide substraterepresented by the reference numerals 1A and 1B from not being separateddue to an adhesive flowing into the cut portion when the guide substrateand the wiring substrate are bonded to each other, which will bedescribed below. It is more preferable that the width of the cut portionbe set in consideration of the gap from both terminals to the outline ofthe substrate.

The guide substrate shown in FIG. 1 has positioning guide patterns 3that are provided in the substrate 1 by etching at four positions.Drilled holes are formed in the positioning guide patterns 3, and wiringsubstrates, each having wiring lines obtained by integrating connectorterminals and cables, are laminated on both sides of the substrate 1with an adhesive interposed therebetween while being aligned with thesubstrate 1, using the drilled holes. In this case, the diameter of thedrilled hole may be, for example, in the range of 2 mm to 4 mm.

When the guide substrate is manufactured by allocating a plurality ofguide substrates to one large substrate, it is not necessary to providethe positioning guide patterns at four corners of each guide substrate,but the positioning guide patterns may be provided at four corners ofthe one large substrate.

Dummy electrode terminal patterns 4 corresponding to the connectionterminal portion that is provided in the plate-shaped connector of theelectronic device to be inserted or removed are formed inside the cutportions 2A and 2B, that is, on both surfaces of the sections 1A and 1B.The dummy electrode terminal patterns 4 may be formed by wiring etchingor plating, or may be printed insulating patterns with conductivity orheat resistance. It is preferable that the dummy electrode terminalpatterns be made of the same material as that forming the connectionterminal portion of the plate-shaped connector in terms of adoptingactual use. In order to improve connection strength to the plate-shapedconnector, it is effective that the dummy electrode terminal patterns 4are not formed. However, the connection terminal portion may not beremoved. Therefore, it is necessary to provide appropriate dummyelectrode terminal patterns. Patterns or solid patterns may be provided.The guide substrate shown in FIG. 1 is used to insert or remove a sensorsubstrate (a single-sided wiring flexible substrate reinforced by aglass epoxy substrate) 20 shown in FIG. 8 as an electronic device, and awiring pattern corresponding to the terminal portion (plate-shapedconnector) 22 can be formed by the above-mentioned etching process.Terminals of the sensor substrate 20 shown in FIG. 8 are arranged at apitch of 1.0 mm, the width of the wiring line is 0.65 mm and the gapbetween the wiring lines is 0.35 mm. The gap from the terminals providedon both sides to the outline of the substrate is 0.675 mm, respectively.Therefore, the width of the cut portion needs to be less than 0.675 mm.When the reference flexible substrate shown in FIG. 8 is used as anelectronic device, it is preferable that the connection terminalpatterns 4 of the guide substrate be formed by gold plating.

As the base 1 shown in FIG. 1, for example, a copper-clad laminate(glass epoxy substrate) manufactured by Hitachi Chemical Co., Ltd. orJapan Gore-Tex Inc. (liquid crystal polymer substrate) is used. Thesubstrate with a thickness of 0.3 mm may be cut into a size that is usedduring a process and subjected to a resist laminate, exposure,development, and copper etching. Then, the patterns may be directlyplated with gold. The plating thickness may be, for example, in therange of 0.3 μm to 0.6 μm.

<Concave Connector Substrate and Method of Manufacturing the Same>

Next, a concave connector substrate manufactured using theabove-mentioned guide substrate and a method of manufacturing theconcave connector substrate will be described.

A first aspect of a method of manufacturing a concave connectorsubstrate according to the invention includes: a process of preparing aguide substrate having a guide/holding region that guides a plate-shapedconnector of an electronic device to be connected to a connectionposition and holds the plate-shaped connector at the connection positionand a cut portion for removing a section having a shape corresponding tothe guide/holding region on at least one side; a process of arrangingand aligning two wiring substrates, each having wiring lines obtained byintegrating connector terminals with cables and through hole connectionportions that are electrically connected to the wiring lines, with bothsurfaces of the guide substrate such that one surface having the wiringlines and the through hole connection portions formed thereon faces theguide substrate and one side of the guide substrate having the cutportion formed therein faces the connector terminals, and applying anadhesive to a region of the guide substrate other than the inside of thecut portion to bond the wiring substrates to the guide substrate; aprocess of bending a portion of the wiring substrate toward the insideof the cut portion of the guide substrate and bringing the wiring linesdisposed in the bent portion into pressure contact with the inside ofthe cut portion; and a process of removing a section inside the cutportion to form the guide/holding region.

A second aspect of a method of manufacturing a concave connectorsubstrate according to the invention includes: a process of preparing aguide substrate having a guide/holding region that guides a plate-shapedconnector of an electronic device to be connected to a connectionposition and holds the plate-shaped connector at the connection positionand a cut portion for removing a section having a shape corresponding tothe guide/holding region; a process of arranging and aligning two wiringsubstrates, each having wiring lines obtained by integrating connectorterminals with cables, a metal layer that is provided on one surfaceopposite to the surface having the wiring lines formed thereon, and awindow that is provided in a region of the metal layer opposite to theconnector terminals, with both surfaces of the guide substrate such thatthe surface having the wiring lines formed thereon faces the guidesubstrate, and applying an adhesive to a region of the guide substrateother than the inside of the cut portion to bond the wiring substratesto the guide substrate; a process of pressing a base surface of thewiring substrate exposed from the window to bend the wiring substrateand bringing the wiring lines disposed in the bent portion into pressurecontact with the inside of the cut portion; and a process of removing asection inside the cut portion to form the guide/holding region. Thethickness of the section of the guide substrate is set to be less thanthe maximum thickness of the plate-shaped connector.

Next, first, the common point between the methods of manufacturing theconcave connector substrate according to the first and second aspects ofthe invention will be described.

When the concave connector substrate is manufactured, first, two wiringsubstrates, each having the wiring lines obtained by integrating theconnector terminals with the cables, are arranged and aligned with theabove-mentioned guide substrate such that one surface having the wiringlines formed thereon faces the guide substrate and then adhered to theguide substrate. FIG. 2 is a diagram illustrating a structure in whichwiring substrates 8 having wiring lines 7 obtained by integrating theconnector terminals with the cables are adhered to both surfaces of thebase (guide substrate) 1. FIG. 2 shows only one surface (front surface),but the wiring substrate is similarly adhered to a surface (rearsurface) opposite to the one surface.

Specifically, FIG. 2 shows a state in which the wiring substrates 8having the wiring lines which are represented by reference numeral 7 andare obtained by integrating the connector terminals with the cables areadhered to both surfaces of the base 1 shown in FIG. 1 such that thewiring lines 7 face at least the inside, that is, the wiring lines 7face the surface of the guide substrate. An adhesive (adhesive sheet)for bonding the wiring substrates 8 to the guide substrate is appliedbetween the layers of the wiring substrates 8 and the guide substrate,and a region in which the adhesive is applied is hatched in FIG. 2. Thehatched region shown in FIG. 2 is a minimum region for applying theadhesive, and the adhesive may be applied to regions other than thehatched region. That is, it is preferable that the adhesive sheet havethe same size as the guide substrate and the wiring substrates in termsof manufacturing efficiency. In this case, the adhesive is applied toregions other than the hatched region shown in FIG. 2. However, sincethe sections 1A and 1B need to be removed in the subsequent process, theadhesive is not applied to the sections 1A and 1B that are disposedinside the cut portions of the guide substrate. In this case, forexample, alignment may be performed by inserting guide pins with adiameter of φ 2.0 into the holes that are formed in advance in theadhesive sheet (adhesive) at positions corresponding to the positioningguide patterns (having holes with a diameter of φ 2.0) represented byreference numeral 3 in FIG. 1 to position the adhesive sheet. After theadhesive sheet is arranged, the adhesive sheet (adhesive) is temporarilyadhered at its own weight by an iron at a temperature where the adhesivesheet is not cured and then the guide pins are removed. For example,KS7003 (with a thickness of 25 μm) manufactured by Hitachi Chemical Co.,Ltd. may be used as the adhesive (adhesive sheet).

In the alignment, it is important to reflect the positional relationshipof the adhesive sheet (adhesive) in the cut portion to the design. Whenthe adhesive sheet (adhesive) is heated or pressed to have an adhesivefunction in the subsequent process, the adhesive sheet flows in thelayer direction. However, in the invention, it is preferable that theadhesive sheet (adhesive) be cut in consideration of the amount of flowsuch that the flow of the adhesive stops outside the cut portion. Thatis, it is preferable to provide a region in which the adhesive sheetdoes not adhere in the vicinity of the cut portion in consideration ofthe amount of flow of the adhesive such that the adhesive in a fluidstate does not flow to the cut portion. Alternatively, it is preferablethat the adhesive sheet be cut such that, even though the adhesive flowsinto the cut portion, the adhesive flowing into the cut portion does nothinder the removal of the section having a shape corresponding to theguide/holding region or the insertion of the plate-shaped connector.

Alternatively, it is preferable to select an adhesive sheet (adhesive)with low fluidity in order to prevent the flow of the adhesive in thelayer direction. For example, KS7003 (with a thickness of 25 μm)manufactured by Hitachi Chemical Co., Ltd. is given as an example of theadhesive sheet on the market. The use of the adhesive sheet prevents theadhesive from flowing to the cut portion even though the cut portion isformed at a position that is about 250 μm inside from the outer end ofthe cut portion.

It is preferable that the design and the setting of the manufacturingconditions including all processes, which will be described below, beperformed such that, even when the surface along the space to be formedwhen the sections, which are denoted by the reference numerals 1A and1B, of the guide substrate becomes the surface along the guide substrateor even when the adhesive protrudes toward the surface, the surface doesnot constrict the outline of an electronic device to be inserted anddoes not prevent the insertion of the electronic device.

The temperature most suitable for lamination is in the range of 160° C.to 180° C., and the pressure of the product is in the range of 2 MPa to4 MPa and preferably equal to or less than 2.5 MPa. The degree of vacuumis equal to or less than 1.33×10² Pa (1.0 torr) and preferably equal toor less than 26.7 Pa (0.2 torr).

It is preferable that the wiring substrate be formed by providing metallayers, such as cooper layers, on both surfaces of a base made of, forexample, a thermosetting resin, a light-curable resin, or athermoplastic resin. FIG. 3 is a diagram illustrating a structure inwhich a metal layer 15 is provided on the outer surfaces of the wiringsubstrates 8 that are arranged on both surfaces of the guide substrateand base deforming windows (windows) 10 are provided in the metal layer15. The base deforming window 10 will be described below.

As the thermosetting resin, one or more resins selected from thefollowing resins may be used: an epoxy resin; a Bismaleimide-Triazineresin; a polyimide resin; a cyanoacrylate resin; a phenol resin; anunsaturated polyester resin; a melamine resin; a urea resin; apolyisocyanate resin; a furan resin; a resorcinol resin; a xylene resin;a benzoguanamine resin; a diallyl phthalate resin; a silicon-modifiedepoxy resin; a silicon-modified polyamide-imide resin; and a benzocyclocyclobutene resin. If necessary, a material obtained by heating amixture of any of the resins and a hardening agent or a hardeningaccelerator thereof to partially harden or completely harden the mixturemay be used. It is preferable to use the glass epoxy resin among theabove-mentioned resins.

As the light-curable resin, one or more resins selected from thefollowing resins may be used: an unsaturated polyester resin; apolyester acrylate resin; a urethane acrylate resin; a silicon acrylateresin; and an epoxy acrylate resin. If necessary, a material obtained byexposing or heating a mixture of any of the resins and a photoinitiator,a hardening agent, or a hardening accelerator thereof to partiallyharden or completely harden the mixture may be used.

As the thermoplastic resin, one or more resins selected from thefollowing resins may be used: a polycarbonate resin; a polysulfoneresin; a polyesterimide resin; a thermoplastic polyimide resin; apolytetrafluoroethylene resin; a polyhexafluoropropylene resin; apolyester ether ketone resin; a vinyl chloride resin; a polyethyleneresin; a polyamide-imide resin; a polyphenylene sulfide resin; apolyoxybenzoate resin; and a liquid crystal polymer. If necessary, amaterial obtained by heating a mixture of any of the resins and ahardening agent or a hardening accelerator thereof to partially hardenor completely harden the mixture may be used.

The above-mentioned insulating resins may be insulating resincompositions, which are mixtures of different kinds of resins. Theinsulating resin composition may include an inorganic filler, such assilica or a metal oxide, as a filler. The inorganic filler may beconductive particles, such as nickel, gold, or silver particles, orresin particles obtained by plating these metal materials.

In addition, BIAC-C manufactured by Japan Gore-Tex Inc. may bepreferably used as the thermoplastic liquid crystal polymer.

As the metal material used in the metal layer, aluminum, iron, nickel,other metal materials, and alloys thereof may be used in addition tocopper. Preferably, electrolytic copper foil or rolled copper foil maybe used since the windows, the terminals, and the cables areelectrically connected to each other by through hole plating in somecases.

The inner surface of the wiring substrate 8 includes the wiring lines 7obtained by integrating the cables with the connector terminals whichare formed by etching the metal layer, and the outer surface thereofincludes the metal layer 15 in which the base deforming windows(windows) 10 are provided in the regions corresponding to the connectorterminals. In FIG. 3, portions, which are denoted by reference numeral10, of the metal layer 15 are etched such that the base deforming window10 includes a predetermined range of the cut portion. The other portionsremain as solid portions that are not etched, and the solid portionsserve as a portion maintained to be flat such that the base is notdeformed during lamination.

After the wiring substrates 8 and other substrates are laminated on theguide substrate 1, a portion of the guide substrate 1 is cut along anoutline extraction line denoted by reference numeral 11 and the sectionthereof is extracted to form the guide/holding region into which theplate-shaped connector of an electronic device, such as a substrate, acard, or a chip, is inserted. The substrate may be cut along the outlineextraction line by a mold or an apparatus using NC data, such as arouter, in order to perform processing with high productivity or highdesignability, such as the formation of a cut portion or a locking hole.

A double-sided copper-clad base obtained by laminating electrolyticcooper foil or rolled cooper foil on both surfaces of a thermoplasticliquid crystal polymer BIAC-C (the thickness of the base: 125 μm)manufactured by Japan Gore-Tex Inc. may be used as the wiring substrate.The thickness of the cooper foil is appropriately selected from 12 μm,18 μm, and 35 μm in consideration of the design specifications of theconnector terminal The cooper foil may be laminated using KS7003 (25 μm)manufactured by Hitachi Chemical Co., Ltd.

Then, portions of the wiring substrate are bent toward the inside of thecut portions of the guide substrate, that is, toward the sections 1A and1B, and the wiring lines disposed in the bent portions are brought intopressure contact with the surfaces of the sections 1A and 1B. In thiscase, as described above, when the base deforming windows (windows) 10are provided in the wiring substrate 8, the portions of the wiringsubstrates can be easily bent.

FIGS. 4A and 4B are a top view (FIG. 4A) and a cross-sectional view of apress structure (FIG. 4B) illustrating a process of bringing baseportions of the wiring substrates 8 into pressure contact with the guidesubstrate using cushion members (plate-shaped low-elasticity bases) 13in a predetermined inner range of the cut portion 2 when the wiringsubstrates 8 are laminated. That is, FIG. 4A is a top view (a portion isshown in a perspective view) illustrating the laminated substrates (thewiring substrates are laminated on both surfaces of the guidesubstrate), and FIG. 4B illustrates the arrangement of the cushionmembers 13 and SUS plates 14 on the laminated substrates and is across-sectional view taken along a center line that extends in thelongitudinal direction of FIG. 4A. In the cross-sectional view of FIG.4B, the dummy electrode terminal patterns 4 that do not appear in theactual cross-section is shown for convenience of illustration. Duringlamination, the cushion member 13 and the SUS plate 14 are sequentiallyarranged outside the base deforming window 10, that is, in the directionin which the wiring substrates 8 are laminated. Then, the laminatedstructure obtained by arranging the cushion members 13 and the SUSplates 14 is heated and pressed. That is, the laminated structure isheated at a predetermined temperature, and a pair of SUS plates 14 thatis disposed on both sides of the laminated structure is pressed inwardfrom both sides. Then, the low-elasticity cushion member 13 is buried inthe base deforming window 10 and presses the wiring substrate 8. Thepressed wiring substrate 8 is bent toward the guide substrate 1, and thewiring lines 7 disposed in the bent portion come into pressure contactwith the inside of the cut portion 2A or 2B, that is, the dummyelectrode terminal patterns 4 disposed inside the section 1A or 1B. Inthis case, the heating temperature is determined by the material formingthe base of the wiring substrate, and may be in the range of 150 to 330°C. Similarly, pressure after heating may be in the range of 1 to 4 MPa.In addition, a vacuum laminator or a vacuum press is given as an exampleof the heating means. The degree of vacuum is equal to or less than1.33×10² Pa (1.0 torr) and preferably equal to or less than 26.7 Pa (0.2torr).

FIG. 5 is a cross-sectional view illustrating a state in which thewiring substrates 8 are bent and the wiring lines 7 are brought intopressure contact with the dummy electrode terminal patterns 4 of theguide substrate, and corresponds to FIG. 4B (in FIG. 5, the SUS plate 14is removed). In the invention, the plate-shaped low-elasticity basemeans a plate-shaped base with an elastic modulus smaller than that ofthe base of the wiring substrate.

The cushion member (plate-shaped low-elasticity base) may be made of amaterial with an elastic modulus smaller than that of the base of thewiring substrate. For example, the cushion member may be made of acombination of PE: Sekisui Chemical polyethylene sheet (thickness: 100μm) and PP: Toray Trefin (thickness: 60 μm). It is possible to adjustthe connection strength according to a combination of materials used inthe cushion member. In FIG. 4B, the SUS plate 14 with a thickness of 2.0mm is arranged on the outermost side.

It is preferable that the thickness of the cushion member be more thanthat of the wiring substrate. As described above, the cushion member ispressed and deformed to bend the wiring substrate toward the dummyelectrode wiring line pattern of the guide substrate. Therefore, whenthe thickness of the cushion member is not equal to or more than that ofthe wiring substrate, it is difficult to sufficiently press the wiringsubstrate. Specifically, when the wiring substrate 8 is BIAC-C and thethickness of the base is 125 μm, the thickness of the cushion member ispreferably in the range of the 125 to 375 μm and more preferably in therange of 160 to 320 μm in terms of a combination of materials used inthe cushion member.

After predetermined outline processing is performed, the section of theguide substrate is removed to complete a concave connector substratewith a concave structure. FIGS. 6A and 6B are diagrams illustrating theprocess. FIG. 6A shows the guide substrate before the sections 1A and 1Bare removed, and FIG. 6( b) shows the guide substrate after the sections1A and 1B are removed. In FIG. 6( b), white regions represented byreference numerals 16A and 16B are the guide/holding regions. A portionof the wiring line 7 is bent in the guide/holding region. When theplate-shaped connectors are inserted into the guide/holding regions 16Aand 16B and reach the connection position, the connection terminals ofthe plate-shaped connectors come into pressure contact with theguide/holding regions and are electrically connected thereto. That is,the wiring lines disposed in the portion bent toward the guide/holdingregion become the connector terminals.

After lamination, the laminate is cooled to a sufficient temperature tohandle the laminate using a protective device, for example, between aroom temperature of about (25° C.) to 80° C. under atmospheric pressure.Then, the cushion members or the SUS plates are removed from the pressstructure, and a portion of the laminate represented by referencenumeral 11 in FIG. 3 is cut by a router. Then, this portion of the guidesubstrate and the portion having the cut portion formed therein aredrawn in the directions of arrows. In this case, it is preferable thatthe temperature be close to the room temperature. In this way, thestructure wiring substrate 8 is deformed in the base deforming window 10is obtained. When the plate-shaped connector is inserted, the wiringlines 7 of the wiring substrate 8 come into contact with the connectionterminals of the plate-shaped connector at appropriate pressure.

In order to easily remove the sections of the guide substrate, as shownin FIG. 6A, the guide substrate 1 may be cut such that portions of thesections 1A and 1B of the guide substrate 1 protrude from the wiringsubstrate 8, and both ends of the guide substrate 1 may protrude fromthe wiring substrate 8. Alternatively, as shown in FIG. 7A, defectiveportions 8A and 8B may be provided in the wiring substrate 8 such thatthe sections 1A and 1B are exposed. The defective portions 8A and 8B ofthe wiring substrate 8 are cut and formed in advance so as to includelines represented by reference numerals 8A and 8B in FIGS. 7A and 7Bwith respect to the two wiring substrates 8 provided on both surfaces ofthe guide substrate 1. The shape and position of the defective portions8A and 8B shown in FIGS. 7A and 7B are just an illustrative example, andthe defective portions 8A and 8B may have any shape and may be disposedat any position as long as they can facilitate the removal of thesections of the guide substrate. The position of the defective portions8A and 8B may be set such that the sensor substrate can be easilyinserted.

According to the above-mentioned structure, it is possible to pick theedge of the guide substrate 1 in the protruding portion or the defectiveportion, that is, the sections 1A and 1B and it is easy to remove thesections.

As such, it is possible to provide the protruding portion by cutting theguide substrate and the wiring substrates such that a portion of thesection of the guide substrate protrudes from the wiring substrate, andit is possible to easily remove the section by pick the protrudingportion when the section is removed. In this way, it is possible toallocate the guide substrate and the wiring substrates to one substratewithout corresponding to each of the guide substrate and the wiringsubstrates. That is, it is possible to achieve arrangement designs of aplurality of connectors so that it is possible to manufacture aplurality of connectors using one laminating process. When the defectiveportions are provided at the positions shown in FIGS. 7A and 7B, it isalso possible to achieve arrangement design and manufacture of pluralityof connectors. As such, when a plurality of connectors is allocated toone substrate, the positioning guide pattern does not need to bearranged for each connector. That is, as described above, thepositioning guide patterns may be provided at four corners of one largesubstrate.

As described above, the concave connector substrate according to theinvention is manufactured using the guide substrate according to theinvention. As described above, it is preferable that the thickness ofthe guide substrate be set in consideration of the thickness of theplate-shaped connector that is used. When a portion that is thicker thanthe connection terminal portion exists in the plate-shaped connector andthe portion is also inserted into the guide/holding region, for example,when a protective film (coverlay) is formed on the portion other thanthe connection terminal portion or when a semiconductor chip or aresistive element is mounted, it is preferable that the thickness of theguide substrate be equal to that of a portion in which the protectivefilm is provided. However, as described with reference to FIGS. 7A and7B, when the defective portions are provided in the wiring substrate inorder to facilitate the removal of the sections of the guide substrate,the plate-shaped connector to be inserted is not affected by the wiringsubstrate in the defective portions of the wiring substrate, and thethickness thereof is not limited. Therefore, in this case, the thicknessof the guide substrate, not the thickness of the portion in which theprotective film is provided, may be equal to that of the connectionterminal portion of the plate-shaped connector.

For example, TPX: Mitsui Chemicals, Inc. X-44B (thickness: 50 μm) isused as a candidate material of a mold release material that is used ina method of manufacturing the guide substrate, the concave connectorsubstrate, or the concave connector substrate. For example, PE: SekisuiChemical polyethylene sheet (thickness: 100 μm) or PP: Toray Trefin(thickness: 60 μm) is used as a candidate material of the cushionmember.

Next, a first aspect of a method of manufacturing a concave connectorsubstrate according to the invention will be described. In the followingdescription, the concave connectors are provided at both ends of theconcave connector substrate. In the first aspect, the concave connectoris provided at one end of the concave connector substrate, and a throughhole connection portion is provided at the other end thereof. Next, thefirst aspect will be described with reference to FIGS. 9 to 12. In FIGS.9 to 12, substantially the same components as those in FIGS. 1 to 8 aredenoted by the same reference numerals.

FIG. 9 is a top view illustrating the completion of the concaveconnector substrate according to the first aspect of the invention. Theconcave connector substrate shown in FIG. 9 has the concave connector atone end (the left side of FIG. 9) and a through hole connection region30 including nine through hole connection portions 32 at the other end(the right side of FIG. 9). On the concave connector side, the metallayer 15 formed on the wiring substrate 8 is exposed to the outside, andthe base deforming window 10 is formed in the metal layer 15. in thethrough hole connection region 30, a total of nine through holeconnection portions 32 are arranged as shown in FIG. 9.

FIG. 10 is a diagram illustrating the rear surface (a surface oppositeto the front surface shown in FIG. 9) of the wiring substrate 8. Asshown in FIG. 10, nine wiring lines 7 of the wiring substrate 8 extendfrom the connector terminals of the concave connector to the throughhole connection portions 32 of the through hole connection region.

In the above-mentioned structure, during actual use, a plate-shapedconnector, such as a sensor substrate, may be fitted and connected tothe concave connector. Pins may be uprightly provided in the throughhole connection portions of the through hole connection region and fixedthereto by soldering, and wiring lines for connecting a measuring deviceto the pins may be connected by crocodile clips. FIG. 11 shows a statein which pins 34 are provided in the through hole connection portion 32and are fixed thereto by soldering. For example, a check terminal forlogic, part number: ST series ST-1-1 (corresponding to a through holewith a diameter of φ 0.8), manufactured by Mac-Eight Co., Ltd., which ison the market, may be used as the pin provided in the through holeconnection portion.

The through holes are not provided in the through hole connection regionof the wiring substrate 8 after the guide substrate and the wiringsubstrates are laminated and the concave connector substrate iscompleted, but are provided in the wiring substrate before thelamination. Therefore, the through holes are electrically connected toonly one side of the guide substrate, but are not electrically connectedto the wiring lines of the wiring substrate that is disposed on theopposite side. Therefore, the wiring lines may extend to only onesurface, or both surfaces.

It is preferable that a base nickel film or a base gold film be formedon the surfaces of the wiring lines 7 and the through hole region 30 byelectrolytic plating before lamination.

In the concave connector substrate, when the plate-shaped connector isfitted and connected to the concave connector, it is necessary to checkthe direction of the connector terminal to be electrically connected tothe pin that is used, that is, the insertion surface of the plate-shapedconnector. When the pins with an appropriate length are inserted intothe through holes and through hole electrodes that extend to both outersides and are fixed, it is possible to perform double-sided access inthe through hole connection region. That is, in this case, the side ofthe through hole to which the pin is soldered can be accessed, and it ispossible to check the connection side according to whether soldering isperformed. When soldering is performed on both surfaces of the throughhole connection region, the plate-shaped connector is used, payingattention to the symmetry of the plate-shaped connector with respect tothe vertical direction. In this case, any side of the plate-shapedconnector may be used to connect the through hole connection region.

Since the concave connector substrate according to the invention is madeof the above-mentioned material, it can be bent. Specifically, theconcave connector substrate can be bent and used, as shown in FIG. 12.Even though the concave connector substrate is bent at a curvatureradius of 10 mm, it is not broken. The bending of the concave connectorsubstrate will be described in detail below.

FIG. 13 is a diagram illustrating an example of a case that accommodatesthe sensor substrate (plate-shaped connector) used in the concaveconnector substrate according to the invention. FIG. 13 shows thestorage of a plurality of sensor substrates 20 in a case 40 with a cover42. In FIG. 13, the sensor substrates 20 are accommodated such thatterminal portions face the cover 42. In the related art, when the sensorsubstrate is used, tweezers are used to pick up the sensor substrate andtake out it from the case, and the sensor substrate is connected to anopenable connector. However, in the invention, the sensor substrate 20is not taken out from the case 40, but the concave connector unit of theconcave connector substrate is allocated to the terminal portion of thecontained sensor substrate 20 with the cover 42 of the case 40 opened.Then, the concave connector unit is fitted to the terminal portion totake out the sensor substrate. In this way, it is possible to take outthe sensor substrate from the case 40 while being connected (fitted) tothe concave connector substrate. Therefore, it is possible to performthe extraction of sensor substrate from the case and the connection ofthe sensor substrate to the concave connector substrate at the sametime, without using the tweezers. As a result, this structure isefficient. In addition, after the sensor substrate connected to theconcave connector substrate is used to perform a sensing operation, itis possible to treat the sensor substrate to which a test solution (forexample, a blood serum or a toxic agent) that should not be directlytouched by the hands, without using, for example, tweezers. Therefore,it is possible to ensure high safety and prevent the contamination oftweezers. In addition, since the measured sensor substrate can bearranged and stored, it is possible to improve the convenience of boththe concave connector substrate and the case.

Next, a second aspect of the concave connector substrate according tothe invention will be described. The second aspect is a structure forimproving the connection strength between a concave connector unit ofthe concave connector substrate and the plate-shaped connector.

The connection strength of the concave connector unit depends on thepattern shape of the base deforming window (window) 10 shown in FIG. 5and the conductor pattern of the guide substrate at a positioncorresponding to the pattern shape, in addition to a cushion structureor the pressure of the process during a process of pressing the wiringsubstrate. In a process of forming the guide/holding region, when thesection disposed inside the cut portion of the guide substrate isremoved, frictional force determines connection strength. When thesection of the guide substrate is set such that the thickness thereof isless than the maximum thickness of the plate-shaped connector in atleast the base deforming window, it is possible to improve theconnection strength.

As described above, when the wiring substrate 8 in the base deformingwindow 10 is pressed and bent, the wiring lines 7 of the wiringsubstrate 8 come into pressure contact with the dummy electrode terminalpatterns provided in the section of the guide substrate 1. In this case,when the section of the guide substrate 1 is set such that the thicknessthereof is less than the maximum thickness of the plate-shaped connectorto be inserted or removed in at least the base deforming window 10, thisstate is maintained after the section is removed. When a plate-shapedconnector thicker than the section is inserted, the plate-shapedconnector is strongly interposed between the bent wiring substrates, andit is possible to improve the connection strength. That is, in this way,when the plate-shaped connector is inserted with the wiring substratebeing bent, the bent portion of the wiring substrate is displaced towardthe center of the plate-shaped connector in the thickness direction. Thewiring substrate urges the plate-shaped connector in the pressuredirection in the bent portion, and the force of the wiring substrate tohold the electrode terminal pattern increases. Therefore, when theplate-shaped connector is inserted or removed, the frictional forceincreases. As a result, the connection strength increases.

When the section of the guide substrate is set such that the thicknessthereof is less than the maximum thickness of the plate-shaped connectorto be inserted or removed, for example, it is considered that a portionof or the entire dummy electrode terminal pattern provided in thesection of the guide substrate is removed or the thickness of at leastthe section is less than that of the plate-shaped connector which isactually used.

As in the above-mentioned structure, actually, the dummy electrodeterminal pattern was not provided in the section of the guide substrate,and a concave connector substrate having connector terminals obtained bypressing and bending the wiring substrate in the substrate deformingwindow was manufactured. Then, the insertion and removal force waschecked. The check result provided that a minimum force of 3.0 N wasensured and the substrate could be repeatedly used a minimum of 100times, as shown in FIG. 14.

<Concave Connector Substrate>

Next, a concave connector substrate according to the invention will bedescribed.

A first aspect of a concave connector substrate according to theinvention is manufactured by the above-mentioned manufacturing methodaccording to the invention and has flexibility. The concave connectorsubstrate is formed such that the width thereof at both ends in thedirection in which the wiring lines extend is more than that at thecenter in the direction in which the wiring lines extend.

FIG. 15A is a top view illustrating an example of a concave connectorsubstrate 50 according to the first aspect of the invention andcorresponds to FIG. 9. In FIG. 15A, the substrate deforming window 10 orthe through hole connection portion is not shown, and only the outlineof the concave connector substrate is shown. Actually, the concaveconnector is provided on one of the left and right sides of the concaveconnector substrate, and the wiring lines are provided in the concaveconnector substrate in the longitudinal direction (the left-rightdirection of FIG. 15A). The concave connector substrate 50 is formedsuch that the width thereof at both ends (left and right ends of FIG.15A) in the direction in which the wiring lines extend is more than thatat the center in the direction in which the wiring lines extend. In thisway, the bending stress of the concave connector substrate is reducedand the concave connector substrate can be easily bent, as compared tothe concave connector substrate that has a constant width from one endto the other end. FIG. 15B is a side view illustrating the bent state ofthe concave connector substrate shown in FIG. 15A. As such, the concaveconnector substrate can be bent. Therefore, when a sensor substrate isinserted into the concave connector and the sensor substrate is immersedin, for example, a container or a cylinder having a test solutiontherein for measurement, it is possible to ensure safety. That is, forexample, when the through hole connection portion is provided at theother end of the concave connector substrate and is fastened by thecrocodile clips of a measuring device, the entire connector becomesunstable. However, when the concave connector substrate is bent, it ispossible to fix the other end to a flat surface and stabilize theconnector. The degree of bending is not limited to that shown in FIG.15B, but the concave connector substrate can be bent as long as thebending strength of the concave connector substrate is allowed.

Next, a second aspect of the concave connector substrate according tothe invention will be described. The concave connector substrateaccording to the second aspect is manufactured by the above-mentionedmanufacturing method according to the invention and has flexibility. Inthe concave connector substrate, when the concave connector substrate isbent at the center in the direction in which the wiring lines extend,cut portions forming non-compliant regions that do not follow thebending are provided on both sides of the concave connector substrate inthe width direction orthogonal to the direction in which the wiringlines extend. The cut portions are set to a size that allows one end ofthe concave connector substrate to be engaged with the non-compliantregions when the concave connector substrate is bent in a substantiallyU shape. The concave connector substrate includes a locking means thatengages the non-compliant regions with one end of the concave connectorsubstrate to lock the non-compliant regions at the engagement position.

The ‘non-compliant region that does not follow bending’ means a regionthat does not follow bending when both ends of the concave connectorsubstrate are bent.

FIGS. 16A to 16C show an example of the concave connector substrateaccording to the second aspect. FIG. 16A is a top view, FIG. 16B is aside view illustrating the state of the concave connector substrateshown in FIG. 16A that is bent and locked in a substantially U shape,and FIG. 16C is a diagram illustrating the state shown in FIG. 16B, asviewed from the upper side (the direction of an arrow X in FIG. 16B). Ina concave connector substrate 52 shown in FIGS. 16A to 16C, similar toFIG. 15A, only the outline of the concave connector substrate is shown.However, the concave connector is formed at one of the left and rightends of the concave connector substrate, and the wiring lines areprovided in the concave connector substrate in the longitudinaldirection (the left-right direction of FIG. 16A).

The concave connector substrate 52 has cut portions 56 and 57 that areformed at both sides in the width direction orthogonal to the directionin which the wiring lines extend along the direction in which the wiringlines extend with a mirror image relationship therebetween. The cutportions 56 and 57 extend in the direction in which the wiring linesextend, and non-compliant regions 52A and 52B that do not follow bendingwhen the concave connector substrate 52 is bent at the center in thedirection in which the wiring lines extend are formed outside the cutportions. Since most of the non-compliant regions 52A and 52B areseparated from the concave connector body 52, the non-compliant regions52A and 52B do not follow bending when the concave connector substrate52 is bent at the center in the direction in which the wiring linesextend. Therefore, the non-compliant regions 52A and 52B can beindependently operated when the concave connector substrate is bent in asubstantially U shape. In addition, the cut portions 56 and 57 are setto a size that allows the non-compliant regions 52A and 52B to beengaged with one end (the left end of FIG. 16A) of the concave connectorsubstrate 52 when the concave connector substrate 52 is bent in asubstantially U shape.

The amount of bending of the concave connector substrate depends on, forexample, a cross-sectional structure including purposes, a materialforming the concave connector substrate, the thickness thereof, and thenumber of wiring lines. Therefore, it is preferable that the size of thenon-compliant region be set in consideration of the amount of bendingsuch that the non-compliant regions are engaged with one end of theconcave connector substrate with a desired amount of bending. Forexample, the length of the non-compliant region may be equal to or lessthan half the length of the concave connector substrate 52 in thedirection in which the wiring lines extend.

In the concave connector substrate 52, cutouts (locking means) 54 and 55and cutouts 58 and 59 are formed at one end of the concave connectorsubstrate 52 and in the non-compliant regions 52A and 52B. When thenon-compliant regions 52A and 52B are engaged with one end of theconcave connector substrate 52, the cutouts 54 and 55 and the cutouts 58and 59 are for locking the non-compliant regions 52A and 52B at theengagement position. As shown in FIGS. 16B and 16C, when the concaveconnector substrate 52 is bent in a substantially U shape, it ispossible to maintain the bent state of the concave connector substrate52 by hooking and locking the cutouts of the non-compliant regions 52Aand 52B to the cutouts of the concave connector substrate 52.

Two cutouts are formed in each of the non-compliant regions 52A and 52B,and it is possible to maintain the bent state at different bendingangles by changing each of the cutouts.

When the non-compliant regions are engaged with one end of the concaveconnector substrate, as the locking means that locks the non-compliantregions at the engagement position, the following structure may be usedin addition to the cutouts shown in FIG. 16A: a locking structure inwhich the non-compliant region is cut out to form a protruding portionand an engaging hole that can be engaged with the protruding portion isformed in the concave connector substrate. FIGS. 17A and 17B show anexample of the concave connector substrate having the above-mentionedstructure. FIG. 17A is a top view, and FIG. 17B is a side viewillustrating the bent and locked state of the concave connectorsubstrate shown in FIG. 17A in a substantially U shape. In a concaveconnector substrate 62 shown in FIGS. 17A and 17B, similar to FIGS. 15and 16, only the outline of the concave connector substrate is shown.However, the concave connector is formed at one of the left and rightends of the concave connector substrate, and the wiring lines areprovided in the concave connector substrate in the longitudinaldirection (the left-right direction of FIG. 17A).

The concave connector substrate 62 has cut portions 66 and 67 that areformed at both sides in the width direction orthogonal to the directionin which the wiring lines extend along the direction in which the wiringlines extend with a mirror image relationship therebetween. The cutportions 66 and 67 extend in the direction in which the wiring linesextend, and non-compliant regions 62A and 62B that do not follow bendingwhen the concave connector substrate 62 is bent at the center in thedirection in which the wiring lines extend are formed outside the cutportions. Since most of the non-compliant regions 62A and 62B areseparated from the concave connector body 62, the non-compliant regions62A and 62B do not follow bending when the concave connector substrate62 is bent at the center in the direction in which the wiring linesextend. Therefore, the non-compliant regions 62A and 62B can beindependently operated when the concave connector substrate is bent in asubstantially U shape. In addition, the cut portions 66 and 67 are setto a size that allows the non-compliant regions 62A and 62B to beengaged with one end (the left end of FIG. 17A) of the concave connectorsubstrate 62 when the concave connector substrate 62 is bent in asubstantially U shape.

In the concave connector substrate 62, engaging holes (locking means) 64and 65 are formed at one end of the concave connector substrate 62, andcutouts 68 and 69 are formed in the non-compliant regions 62A and 62B.When the non-compliant regions 62A and 62B are engaged with one end ofthe concave connector substrate 62, the engaging holes 64 and 65 and thecutouts 68 and 69 are for locking the non-compliant regions 62A and 62Bat the engagement position. As shown in FIG. 17B, when the concaveconnector substrate 62 is bent in a substantially U shape, it ispossible to maintain the bent state of the concave connector substrate62 by inserting the non-compliant regions 62A and 62B into the engagingholes 64 and 65 and hooking and locking the cutouts 68 and 69 of thenon-compliant regions 62A and 62B to the engaging holes of the concaveconnector substrate 62.

Two cutouts are formed in each of the non-compliant regions 62A and 62B,and it is possible to maintain the bent state at different bendingangles by changing each of the cutouts.

When the sensor substrate 20 shown in FIG. 8 is connected to the concaveconnector substrate according to the second aspect and is used tomeasure a sample in the cylinder, it is preferable that the length ofthe cut portion be appropriately set in consideration of the length ofthe connected sensor substrate and the positional relationship between amounting surface on which the bent concave connector substrate is placedand the bottom of the cylinder such that the bent concave connectorsubstrate to which the sensor substrate is connected is maintained atthe measurement position. FIGS. 18A and 18B are schematic diagramsillustrating a state in which the concave connector substrate 52 shownin FIGS. 17A and 17B is bent and locked and the sensor substrate 20 isconnected to one end of the sensor substrate in the bent and lockedstate to measure a sample in a cylinder 70. In FIGS. 18A and 18B, thecylinder 70 is provided below a mounting surface G on which the concaveconnector substrate 52 is placed, and a sample to be measured is putinto the cylinder 70. In this state, when the concave connectorsubstrate 52 and the sensor substrate 20 are used to measure the samplein the cylinder 70 and the leading end of the sensor substrate 20 comesinto contact with the bottom of the cylinder 70, the other end of theconcave connector substrate 52 floats from the mounting surface G. As aresult, the concave connector substrate becomes unstable (FIG. 18A).Therefore, the length of the cut portion of the concave connectorsubstrate is appropriately adjusted such that the leading end of thesensor substrate comes into contact with the bottom of the cylinder andthe other end of the concave connector substrate comes into contact withthe mounting surface G. In this way, it is possible to stabilize theconcave connector substrate (FIG. 18B).

Next, another example of the concave connector substrate according tothe second aspect will be described. FIG. 19 is a top view illustratinga concave connector substrate 70 according to another example. In theconcave connector substrate 70 shown in FIG. 19, a concave connector isformed on the left side of FIG. 19, and a through hole connection region71 is formed on the right side of FIG. 19. Eighteen through holeconnection portions 79 are provided in the through hole connectionregion 71. As shown in FIG. 20, eighteen pins 78 may be uprightlyprovided. Although not shown in the drawings, similar to the structureshown in FIG. 10, in the concave connector substrate 70, the connectorterminals of the concave connector are electrically connected to throughhole connection portions 79 of the through hole connection region 71through the wiring lines.

The concave connector substrate 70 has cut portions 72 and 73 that areformed at both sides in the width direction orthogonal to the directionin which the wiring lines extend along the direction in which the wiringlines extend with a mirror image relationship therebetween. The cutportions 72 and 73 extend in the direction in which the wiring linesextend, and non-compliant regions 70A and 70B that do not follow bendingwhen the concave connector substrate 70 is bent at the center in thedirection in which the wiring lines extend are formed outside the cutportions. Similar to the non-compliant regions 52A and 52B shown in FIG.16, the non-compliant regions 70A and 70B can be independently operatedwhen the concave connector substrate is bent in a substantially U shape.In addition, the cut portions 72 and 73 are set to a size that allowsthe non-compliant regions 70A and 70B to be engaged with one end (theleft end A of FIG. 19A) of the concave connector substrate 70 when theconcave connector substrate 70 is bent in a substantially U shape.

In the concave connector substrate 70, cutouts (locking means) 74 and 75and circular engaging holes 76 and 77 are formed in the non-compliantregions 70A and 70B and at one end of the concave connector substrate70. When the non-compliant regions 70A and 70B are engaged with one endof the concave connector substrate 70, the cutouts 74 and 75 and thecircular engaging holes 76 and 77 are for locking the non-compliantregions 70A and 70B at the engagement position. As shown in FIGS. 21 and22, when the concave connector substrate 70 is bent in a substantially Ushape, it is possible to maintain the bent state of the concaveconnector substrate 70 by hooking and locking the cutouts of thenon-compliant regions 70A and 70B to the engaging holes of the concaveconnector substrate 70.

Two cutouts and engaging holes are formed in each of the non-compliantregions 70A and 70B, and it is possible to maintain the bent state atdifferent bending angles by changing each of the cutouts. FIG. 21 showsa case in which the cutouts 74 and 75 provided at the leading ends ofthe non-compliant regions 70A and 70B are engaged with the locking holes76 and 77 provided at the leading end of the concave connector substrate70 and the concave connector substrate 70 is bent at an obtuse angle.FIG. 22 shows a case in which the cutouts different from theabove-mentioned cutouts are engaged with the locking holes differentfrom the above-mentioned locking holes and the concave connectorsubstrate 70 is bent at an acute angle.

It is preferable that the non-compliant regions having the cutouts orthe locking holes be formed at the same time as the laminate is cut intoindividual connectors. In many cases, it is necessary to adjust thepositions or shapes of the non-compliant regions and the engaging holesaccording to circumstances. Therefore, as described above, it ispreferable to use a router using NC data.

As described above, according to the invention, in the system in whichan electronic device, such as an electrochemical measurement substrate,a memory card, or a sensor chip, is inserted into the concave connectorso as to be electrically connected thereto, the manufacture of a caseusing a precision mold, the mechanical processing of terminal leads, anda packaging process for them are not needed in order to accurately fitthe plate-shaped connector of the electronic device to the concaveconnector. In addition, it is easy to reduce the manufacturing costs ofthe connector when responding to small quantity batch production. Inaddition, the flexibility of the design of the thickness or connectionterminals of a substrate, a card, or a chip to be inserted is improved,and it is possible to obtain wiring lines that are obtained byintegrating the connector terminals and the cables and are capable ofimproving connection accuracy and the flexibility of the design andreducing manufacturing costs. In this way, it is not necessary toindividually mount the connectors and the cables and it is possible tosignificantly reduce manufacturing costs. In addition, it is possible tocontinuously change connection strength by adjusting the structure of amaterial during lamination or the base deforming window duringlamination.

<Measuring Kit>

Next, a measuring kit according to the invention will be described.

The measuring kit according to the invention is used to measure a sampleusing a sensor with a connector obtained by inserting a sensor substrateinto the guide/holding region of the above-described concave connectorsubstrate according to the invention. The measuring kit includes acylinder into which the sensor substrate and a sample to be measured areintroduced and a barrel-shaped case body having the cylinder providedtherein. Grooves with the bottoms to which the bottoms of the cylindersare fitted are formed in the inner bottom of the case body. A cutoutthat holds the sensor substrate and extends from an opening portion ofthe cylinder to the bottom is formed in the inner wall of the cylinder.

Next, the measuring kit according to the invention will be describedwith reference to the drawings.

FIG. 23 is a perspective view illustrating an example of the measuringkit according to the invention, and FIG. 24 is a cross-sectional viewillustrating the measuring kit shown in FIG. 23 taken along twocylinders. A measuring kit 80 includes a barrel-shaped case body 82 andtwo circular cylinders 88 that are vertically provided in the case body82 and have a cylindrical shape with the bottom. As shown in FIG. 23,grooves with the bottom to which the bottoms of the cylinders 88 arefitted are formed in the inner bottom of the case body 82, and O-rings90 are provided in the grooves with the bottom. The O-ring 90 is formedsuch that the inside diameter thereof is substantially equal to theoutside diameter of the circular cylinder 88, and is made of, forexample, a resin or rubber with elasticity. When the cylinder 88 isfitted to the groove with the bottom, the O-ring 90 fastens the cylinder88, thereby strongly fixing the cylinder 88. In this way, it is possibleto prevent the cylinder from being detached from the groove with thebottom.

A metal plate (plate-shaped member) 84 is provided on the inner bottomof the case body 82 so as to cover the inner bottom of the case body 82.The metal plate 84 has opening portions through which the circularcylinders 88 pass and which lock the O-rings 90. That is, the metalplate 84 has the opening portions with a shape that is substantially thesame as that of the bottom of the cylinder 88. When the metal plate 84is provided on the inner bottom of the case body 82, the vicinities ofthe opening portions of the metal plate 84 are positioned immediatelyabove the O-rings 90, and the opening portions lock the O-rings 90. Inthis way, it is possible to prevent the O-rings 90 from being detached.

The metal plate 88 also has a heat dissipation property and dissipatesheat from the case body 88.

FIG. 24 shows the structure in which the O-rings 90 are constantlycontacted with and locked to the metal plate 84, but the invention isnot limited to the structure. For example, the O-ring 90 may be buriedat a position lower than the bottom of the case body 82 and may belocked by the bottom structure. In this case, when there is apossibility that the O-ring 90 will be detached, the metal plate 84locks the O-ring 90, and it is possible to prevent the detachment of theO-ring 90.

The cylinder 88 has cutouts 88A that extend from the opening portion ofthe cylinder 88 to the bottom as a means for holding the sensorsubstrate. FIG. 25A is a perspective view illustrating the cylinder 88,and FIG. 25B is a diagrams illustrating the cylinder 88, as viewed fromthe upper side. Two cutouts 88A are formed on the center line of theopening portion (circular shape) of the cylinder 88, and a segmentlinking a pair of cutouts 88A has a length that is substantially equalto the width of the sensor substrate. When the sensor substrate isinserted into the opening portion of the cylinder 88 such that the sidesurface thereof is inserted along the cutouts 88A, it is possible toarrange the sensor substrate at a predetermined position in the cylinder88.

In FIGS. 23, 25A, and 25B, two cutouts are provided in the cylinder 88,but four or more cutouts may be provided. For example, in a cylinder 89shown in FIGS. 26A and 26B, eight cutouts are provided. In this case, itis possible to insert the sensor substrate in four directions.

A transparent cover plate 86 is provided at an upper part of the casebody 82. The transparent cover plate 86 is provided with circular holesthat have substantially the same shape as the opening portion of thecircular cylinder 88 such that the upper part of the cylinder 88protrudes from the transparent cover plate 86 when the cylinder 88 isfixed at a predetermined position of the case body. When a sample ismeasured with the concave connector substrate 70 being bent, one end ofthe concave connector substrate 70 comes into contact with thetransparent cover plate 86, and the transparent cover plate 86 functionsto prevent the wobbling of the concave connector substrate 70. Inaddition, the transparent cover plate 86 has a function of preventingthe cylinder from fluctuating due to a little force applied when aconnector with a sensor is connected to a measuring device, in additionto the function of mounting the concave connector substrate. Further,the transparent cover plate 86 has a function of preventing anunnecessary falling object from being mixed with the case body duringmeasurement. For example, water, ice water, or hot water is supplied tothe case body 82 in order to adjust the temperature of the sample in thecylinder 88. The transparent cover plate 86 provided on the case body 82can keep the temperature of the sample. The transparent cover plate 86is not fixed to the case body 82, but is only placed on the case body82.

The measuring kit according to the invention is used together with thesensor with a connector obtained by inserting the sensor substrate intothe guide/holding region of the concave connector substrate according tothe invention, and the usage thereof will be described below. First, thesensor with a connector will be described.

FIG. 27A is a plan view illustrating a sensor substrate 90, and FIG. 27Bis a rear view. The sensor substrate 90 includes electrodes 94 and 96formed only on one surface thereof. The electrodes 94 and 96 areconnected to a terminal portion 92 through wiring lines that are buriedin the substrate. The electrodes 94 include a large electrode and asmall electrode, and the electrodes 96 includes sixteen minuteelectrodes. A total of eighteen electrodes are provided and connected toeighteen terminals of the terminal portions 92 which are provided on thefront surface and the rear surface.

FIG. 28 shows the insertion of the sensor substrate 90 into the concaveconnector of the concave connector substrate 70. In this state, forexample, even when the sensor substrate 90 is inserted into the cylinderthat is provided in the vertical direction to measure a sample, thestate of the concave connector substrate 70 with respect to the sensorsubstrate 90 is largely unstable. However, when the measuring kitaccording to the invention is used, it is possible to measure a samplein a stable state.

FIG. 29 shows a state in which the connector substrate 70 of the sensorwith a connector is bent at an obtuse angle as shown in FIG. 21 and isinserted into the cylinder 88 provided in the measuring kit 80. In thisway, when the sensor with a connector is used to measure a sample, theperiphery of the through hole connection region 71 of the concaveconnector substrate 70 comes into contact with the transparent coverplate 86 and this state can be maintained. Therefore, even when thewiring lines are connected to pins 78 provided in the through holeconnection portion through, for example, crocodile clips, it is possibleto stabilize the connection without any wobble.

FIG. 30 shows a state in which the connector substrate 70 of the sensorwith a connector is bent at an acute angle as shown in FIG. 22 and isinserted into the cylinder 88 provided in the measuring kit 80. In thisstate, a portion of the concave connector substrate 70 comes intocontact with the transparent cover plate 86, and it is also possible tostabilize the contact without any wobble.

<Sensor Substrate Interpolated Cylinder>

A sensor substrate interpolated cylinder according to the inventionincludes a sensor substrate that is inserted into the guide/holdingregion of the above-mentioned concave connector substrate according tothe invention and a cylinder into which the sensor substrate isinserted. The cylinder includes a sample feed port through which asample is introduced into the cylinder and a sealing means that seals anopening portion of the cylinder and the sensor substrate.

FIG. 31 is a perspective view illustrating an example of the sensorsubstrate interpolated cylinder according to the invention. A sensorsubstrate interpolated cylinder 100 shown in FIG. 31 includes a cylinder102 and a sensor substrate 104 that is inserted into the cylinder 102. Afilm 106 is provided in the opening portion of the cylinder 102 in orderto prevent the leakage of the introduced sample. The film 106 has a cutportion and a terminal portion 105 of the sensor substrate 104 protrudesfrom the cut portion. It is possible to insert the terminal portion 105into the guide/holding region of the concave connector substrate. Asample feed port 108 for introducing a sample to be measured into thecylinder is provided in the side surface of the cylinder 102. It ispreferable that a check valve for preventing the leakage of theintroduced sample due to a counter current be provided in the samplefeed port 108. A means for introducing a sample from the sample feedport 108 is not particularly limited. For example, an injector, adropper, a micropipette, a MEMS, or a small pump that is driven by asmall motor may be used to introduce samples.

<Flow Cell>

In the above-mentioned structure, the sample that is introduced into thecylinder and is measured does not flow, but remains stationary, and thesample in the stationary state is measured. On the contrary, when asample liquid is measured in a fluid state, it is preferable to use aflow cell. FIG. 32 is a schematic diagram illustrating the measurementof a flowing sample liquid using a flow cell 110. The concave connectorsubstrate 70 connected to the flow cell 110 into which the sensorsubstrate 90 is inserted, and the wiring lines are connected to thethrough hole connection portion of the concave connector substrate 70.The wiring lines are connected to an external measuring device (notshown). The concave connector substrate 70 and the sensor substrate 90are the same as those shown in FIGS. 19 and 27. The same components asthose shown in FIGS. 19 and 27 are denoted by the same referencenumerals and a description thereof will be omitted.

The flow cell 110 includes an inlet 112 for introducing a flowing sampleand an outlet 114 for discharging the introduced sample. Duringmeasurement, a sample is introduced from the inlet 112 of the flow cell110 and is discharged from the outlet 114 by, for example, a pump. Inthis way, the sample flows. The electrode of the sensor substratedetects and measures the flowing sample.

In the above-mentioned structures, the sensor substrate is inserted intothe cylinder having a sample introduced thereinto to measure the sample.However, for example, when the user wants to measure a small amount ofsample in a short time, it is possible to easily measure the sampleusing the following sensor substrate.

FIG. 33A is a top view illustrating a sensor substrate 120, and FIG. 33Bis a cross-sectional view illustrating the sensor substrate 120. Thesensor substrate 120 is inserted into the guide/holding region of theconcave connector substrate.

The sensor substrate 120 has a concave portion 122 formed in the surfacethereof, and includes three electrodes corresponding to a workingelectrode 128, a counter electrode 124, and a reference electrode 126 inthe concave portion 122.

The concave portion 122 is disposed at a depth of 0.025 mm to 10.0 mmfrom the surrounding surface. The working electrode 128, the counterelectrode 124, and the reference electrode 126 disposed in the concaveportion 122 are connected to a terminal portion 132 through wiring lines130 that are buried in the sensor substrate. That is, as shown in FIG.33B, the wiring lines connected to the three electrodes are buried inthe sensor substrate without being exposed from the surface.

In the above-mentioned structure, when a sample is measured, it ispossible to measure the sample only by placing the sensor substrate 120on a horizontal plane and introducing a sample liquid into the concaveportion 122. In this case, the amount of introduced sample liquid needsto be sufficient to cover all of the three electrodes in the concaveportion 122 at the same time. When the volume of the concave portion 122is sufficiently small, it is possible to measure a sample by putting afew drops of sample using, for example, a dropper.

In the above-mentioned aspects, the sensor substrate may be used as, forexample, a temperature sensor or a pH sensor.

FIG. 34 is a schematic diagram illustrating an aspect in which thesensor substrate is used as a temperature sensor. In FIG. 34, fourelectrodes (I₁, I₂, V₁, and V₂) are connected to a resistor 134. In thestructure, the resistance value of the resistor 134 is measured by a4-terminal method, and the measured resistance value is converted into atemperature using the temperature-change characteristics of theresistance value. In this way, it is possible to obtain the temperature.

In this case, a distance a shown in FIG. 34 is about 5 mm in theresistor 134, and the resistor 134 can be finely formed by electron beamlithography using a positive resist and a lithography method thatremoves the resist after a metal film is deposited. For example, copper,nickel, or gold may be used as a metal material to be deposited, and itis preferable to use platinum.

The pH sensor can be implemented using a correlation diagram betweenpotential and pH (a potential-pH diagram; Pourbaix diagram). That is, itis possible to measure the potential between an electrode that functionsas a reference when it is immersed in a sample and an electrode whosesurface potential varies depending on pH using at least two electrodesof the sensor substrate, and calculate pH on the basis of the measuredpotential, using the potential-pH diagram (Pourbaix diagram)corresponding to metal forming the electrodes. For example, when a goldelectrode is used, it is possible to calculate pH for the measuredpotential from the potential-pH diagram of gold. In this case, thereference electrode may be formed by applying and drying, for example,the carbon paste disclosed in WO/2009/041554. A film made of the carbonpaste is characterized in that it has a surface roughness Ra of 20 to100 nm and has a very flat surface. In this way, the film does notabsorb a potential inhibitor, and is stabilized as the referenceelectrode.

As described above, in the electrode formed by applying and drying thecarbon paste, the surface roughness Ra of the film made of the carbonpaste is in the range of 20 to 100 nm. However, when the surfaceroughness Ra is more than 100 nm, the film absorbs the potentialinhibitor and is unstable as the reference electrode. It is impossibleto produce a film with a surface roughness Ra of less than 20 nm. Evenif possible, it is very difficult to produce the film with a surfaceroughness Ra of less than 20 nm, which is not practical.

It is important that the purity of the gold electrode be high.Therefore, it is preferable that the carbon paste be applied to thewiring lines in the base and dried such that metal is not diffused fromthe wiring lines below the gold electrode and a gold electrode bedeposited thereon. In this way, it is possible to ensure the purity ofgold and flatness.

The flatness of (1) the gold electrode formed by plating, (2) theelectrode formed by applying and drying carbon paste, ensuring closeadhesion, and depositing gold in an oxygen plasma atmosphere, and (3)the electrode formed by applying and drying carbon paste was evaluated.

The evaluation results are shown in the following Table 1.

TABLE 1 Kind of Surface electrode Surface finish roughness Ra Remarks(1) Gold electrode Plating with nickel Ra < 1 μm and gold etc. (2) Goldelectrode Carbon paste + 50 nm < Ra < gold deposition 100 nm (3)Reference Carbon paste Ra < 50 nm Minimum electrode value: 20 nm

As can be seen from Table 1, the gold electrode formed by applyingcarbon paste to the wiring lines in the base, drying it, and depositinggold thereon has a surface roughness Ra of 50 to 100 nm. In addition, itis possible to block the diffusion of metal from the wiring lines in thebase using the carbon paste. Therefore, it is possible to prevent areduction in the purity of gold in the gold electrode. That is, the useof the carbon paste makes it possible to improve flatness and the purityof gold.

Similarly, when the reference electrode is made of carbon paste, it ispossible to obtain high flatness.

The two electrodes are not necessarily arranged on the same surface ofthe substrate, but may be arranged on both surfaces of an insulatingbase. In all of the sensor substrates according to the invention, assuch, the electrodes are not necessarily provided in the same plane.

For example, it has been known that, as the distance between thereference electrode and the working electrode is reduced, sensitivity isimproved. Therefore, it is preferable that the working electrode and thecounter electrode be arranged on the same surface, the referenceelectrode be arranged in the vicinity of a position opposite to theworking electrode on the rear surface, and a through hole passingthrough the vicinities of the working electrode and the referenceelectrode be provided in the base. The through hole is provided in orderto ensure the flow path of a sample liquid between the front surface andthe rear surface of the sensor substrate. According to theabove-mentioned structure, the sample liquid can pass between theworking electrode and the reference electrode through the through holeat a short distance. Therefore, the distance between the electrodes issubstantially reduced, and it is possible to ensure the sensitivity orreproducibility of a sensor and simplify a manufacturing process. Thisstructure is also implemented by the concave connector substrateaccording to the invention in which, even though the terminal portionsof the sensor substrate are arranged on both surfaces, connection isavailable.

DESCRIPTION OF NUMERALS

-   -   1: BASE (GUIDE SUBSTRATE)    -   1A, 1B: SECTION    -   2A, 2B: CUT PORTION    -   3: POSITIONING GUIDE PATTERN    -   4: DUMMY ELECTRODE TERMINAL PATTERN    -   5: INDIVIDUAL OUTLINE DATA FRAME (OUTLINE)    -   6: ALLOCATED INDIVIDUAL DATA FRAME (REGION IN WHICH SINGLE DATA        IS DESIGNED)    -   7: WIRING LINE    -   8: WIRING SUBSTRATE    -   8A, 8B: DEFECTIVE PORTION    -   9: REGION IN WHICH NO ADHESIVE IS APPLIED (GUIDE SUBSTRATE        SECTION)    -   10: BASE DEFORMING WINDOW (WINDOW)    -   11: REMOVAL LINE FOR REMOVING SECTION OF GUIDE SUBSTRATE        (OUTLINE REMOVAL LINE)    -   12: ADHESIVE LAYER    -   13: CUSHION MEMBER (PLATE-SHAPED LOW-ELASTICITY BASE)    -   14: SUS PLATE    -   15: METAL LAYER    -   16A, 16B: GUIDE/HOLDING REGION    -   20, 90, 120: SENSOR SUBSTRATE (PLATE-SHAPED CONNECTOR)    -   22, 92: TERMINAL PORTION    -   30, 71: THROUGH HOLE CONNECTION REGION    -   32: THROUGH HOLE CONNECTION PORTION    -   34, 78: PIN    -   40: CASE    -   50, 52, 62, 70: CONCAVE CONNECTOR SUBSTRATE    -   52A, 52B, 62A, 62B, 70A, 70B: NON-COMPLIANT REGION    -   54, 55, 58, 59, 68, 69, 74, 75: CUTOUT    -   56, 57, 66, 67, 72, 73: CUT PORTION    -   64, 65, 76, 77: ENGAGING HOLE    -   80: MEASURING KIT    -   82: CASE BODY    -   84: METAL PLATE    -   86: TRANSPARENT COVER PLATE    -   88: CYLINDER    -   88A: CUTOUT    -   94: (LARGE AND SMALL) ELECTRODE    -   96: MINUTE ELECTRODE    -   100: SENSOR SUBSTRATE INTERPOLATED CYLINDER    -   102: CYLINDER    -   104: SENSOR SUBSTRATE    -   106: FILM    -   110: FLOW CELL    -   122: CONCAVE PORTION    -   124: COUNTER ELECTRODE    -   126: REFERENCE ELECTRODE    -   128: WORKING ELECTRODE    -   134: RESISTOR

1. A method of manufacturing a concave connector substrate comprising:preparing a guide substrate having a guide/holding region that guides aplate-shaped connector provided with an electronic device to beconnected to a connection position and holds the plate-shaped connectorat the connection position and a cut portion for removing a sectionhaving a shape corresponding to the guide/holding region; arranging andaligning two wiring substrates, each having wiring lines obtained byintegrating connector terminals with cables, a metal layer that isprovided on one surface opposite to a surface having the wiring linesformed thereon, and a window that is provided in a region of the metallayer facing the connector terminals, with both surfaces of the guidesubstrate such that the surface having the wiring lines formed thereonfaces the guide substrate, and applying an adhesive to a region of theguide substrate other than the inside of the cut portion to bond thewiring substrates to the guide substrate; pressing a base surface of atleast one wiring substrate of the two wiring substrates exposed from thewindow to bend the wiring substrate and bringing the wiring linesdisposed in the bent portion into pressure contact with the inside ofthe cut portion; and removing the section inside the cut portion to formthe guide/holding region, wherein a thickness of the section of theguide substrate is set to be less than a maximum thickness of theplate-shaped connector.
 2. The method of manufacturing a concaveconnector substrate according to claim 1, wherein a dummy conductorpattern corresponding to a conductor pattern of the plate-shapedconnector is formed in the section of the guide substrate, and a portionof or the entire dummy conductor pattern in the section of the guidesubstrate is removed.
 3. The method of manufacturing a concave connectorsubstrate according to claim 1, wherein a dummy conductor patterncorresponding to a conductor pattern of the plate-shaped connector isformed in the section of the guide substrate, and the thickness of thedummy conductor pattern in the section of the guide substrate is lessthan that of the conductor pattern of the plate-shaped connector.
 4. Themethod of manufacturing a concave connector substrate according to claim1, wherein a plate-shaped low-elasticity base is provided outside thewiring substrate in a laminated direction, and the base surface of thewiring substrate exposed from the window is pressed through theplate-shaped low-elasticity base to bend the wiring substrate.
 5. Themethod of manufacturing a concave connector substrate according to claim1, wherein the wiring substrate is obtained by forming wiring lines on abase made of a thermosetting resin, a light-curable resin, or athermoplastic resin.